Stäubli introduces advanced cooling solutions for AI data centers

The rapid growth of artificial intelligence (AI) is driving a surge in energy consumption and heat generation within data centers. To address these challenges, Stäubli has introduced advanced electrical and liquid cooling connectivity solutions, specifically designed for the OCP Open Rack v3 (ORv3) architecture. This innovation aims to enhance the efficiency and reliability of AI system scaling and thermal management.

According to Stäubli, the company is working closely with key players across the data center ecosystem to ensure that emerging solutions align with the operational requirements of high-density computing environments. By integrating power distribution and thermal management, Stäubli’s solutions offer a more seamless and efficient infrastructure for data centers.

Reliable power delivery and effective heat removal are crucial for maintaining continuous operation. Stäubli’s electrical connectors, including those compatible with ORv3 architectures, support safe and efficient power distribution across the data center, from switchgear, uninterruptible power supply (UPS) systems, and power distribution units to rack-level applications. These connectors are designed for high-current applications, ensuring reliable power delivery even in high-density environments.

Simultaneously, liquid cooling technologies enabled by non-spill quick couplings, such as Stäubli’s UQD range, are vital for managing increasing thermal loads. These solutions simplify maintenance operations and are particularly useful in spaces where thermal performance is critical. Stäubli’s liquid cooling portfolio covers the entire cooling loop, from high-flow connectors supporting facility infrastructure, cooling distribution units (CDUs), and manifold connections to compact quick couplings designed for servers, blades, and next-generation optical modules.

By combining its expertise in electrical and fluid connectivity, Stäubli helps data center operators improve uptime, scalability, and energy efficiency. This integrated approach is essential for supporting the transition toward increasingly dense and modular AI infrastructures. As AI infrastructures continue to evolve, the industry's focus is shifting from simply delivering more power or more cooling to ensuring that both systems work together efficiently, reliably, and at scale.

Jean Christophe Duisit, a key figure at Stäubli, emphasized the company's unique expertise in addressing these challenges. "At Stäubli, our expertise in electrical and fluid connectivity allows us to support this transformation and help shape the future of data center infrastructure," he stated.

Stäubli will showcase its latest innovations at major industry events, including the Supercomputing conference in Chicago from November 15-20, 2026, and the OCP Global Summit in San Jose from October 12-15, 2026. Attendees are encouraged to visit Stäubli’s booth to discuss the latest challenges and innovations in power distribution and liquid cooling for AI data centers.

Stäubli, a global industrial and mechatronic solution provider with four dedicated divisions, Electrical Connectors, Fluid Connectors, Robotics, and Textile, operates in 28 countries with a worldwide network of partners. The company’s solutions are designed to improve productivity, performance, and safety across a wide range of industries.