ASML and TSMC Collaborate on Larger Photomasks for High-NA EUV Lithography
News related to:ASML Holding N.V · 2 min read
ASML and TSMC have announced a collaborative initiative aimed at driving the transition to larger 12-inch photomasks for High-NA Extreme Ultraviolet (EUV) lithography. This move is expected to significantly enhance the semiconductor manufacturing process, boosting productivity and reducing costs.
The two companies aim to establish a 12-inch mask pilot line by 2031, with the goal of integrating 12-inch High-NA lithography systems into advanced node production by 2033. This initiative underscores the strong support from the broader semiconductor industry, with major suppliers and partners showing interest in participating.
Christophe Fouquet, CEO of ASML, stated, "We expect the adoption of High-NA EUV to increase progressively along the device scaling roadmap, first using current 6-inch masks and then further supported by 12-inch masks, which enable greater scanner productivity and allow the industry to meet the demand for smaller, faster, and more energy-efficient chips."
TSMC Chairman and CEO, Dr. C.C. Wei, added, "By bringing together expertise from across the industry's value chain, we hope to keep providing the benefits of cutting-edge technology through continuous innovation that lowers barriers and puts advanced solutions accessible at scale."
The transition to larger photomasks is expected to address several challenges faced in the current 6-inch mask technology. These include increased productivity, lower production costs, and the elimination of stitching constraints, which can lead to higher-quality chip production.
The 12-inch photomask technology will be crucial in the next phase of semiconductor manufacturing, particularly for advanced nodes. TSMC plans to use ASML's High-NA technology in high-volume manufacturing for advanced nodes starting in 2030. As technology nodes advance, TSMC expects the number of layers requiring High-NA EUV to rise, driven by the increasingly complex transistor architectures needed for AI applications.
The collaboration between ASML and TSMC is part of a broader industry-wide effort to address the complexities of High-NA EUV lithography. The companies believe that by working together, they can unlock new possibilities and bring advanced semiconductor solutions to market more efficiently.
In conclusion, this initiative marks a significant step forward in the evolution of semiconductor manufacturing technology, with the potential to revolutionize the industry's approach to producing smaller, faster, and more energy-efficient chips.