Scintil Photonics Names Alexandru Romanescu as Vice President of Process Engineering

GRENOBLE, France, Sept. 29, 2026 /CourierPR/ -- Scintil Photonics, a global leader in Heterogeneous Integrated Photonics for next-generation DWDM AI infrastructure, has appointed Alexandru Romanescu as Vice President of Process Engineering. Romanescu brings nearly two decades of experience in semiconductor and photonic processes, having taken them from development into volume manufacturing. His career has spanned the entire journey of bringing a process to volume, from industrializing a photonic integrated circuit pilot line to driving photonic integration platforms from development to a design- and manufacturing-ready state. He has set process control, test, and qualification requirements at each maturity step, managed operations that span supply chain, foundry relations, quality systems, and production test, and developed advanced CMOS logic processes with volume-ramp support across multiple products and customers. Romanescu also managed the industrial transfer of RF semiconductor processes into foundry production.

Romanescu holds a PhD in microelectronics from Université de Grenoble and will now lead process engineering, qualification, and yield across Scintil's foundry network behind SHIP™ (Scintil Heterogeneous Integrated Photonics), the company's photonic integration platform. SHIP™ integrates active lasers with established silicon photonics on a single chip and has been validated on Tower Semiconductor's production lines. It uses standard foundry flows and wafer-level testing. LEAF Light™, Scintil's first commercial product, is a single-chip DWDM laser source available to customers through an early-access evaluation program.

Scintil Photonics is headquartered in Grenoble, France, with operations across North America. The company is the global leader in DWDM laser sources for AI, using its SHIP™ (Scintil Heterogeneous Integrated Photonics) technology to develop LEAF Light™, the world's first single-chip DWDM laser source for high-density optical connectivity in scale-up networks. LEAF Light™ enables hyperscalers to meet the power, tail latency, utilization, and bandwidth demands of large-scale GPU clusters, leveraging next-generation co-packaged optics (CPO).