MACOM Unveils 3.2T Chipset Solution for High-Speed Optical Connectivity
News related to:MACOM Technology Solutions Inc · 1 min read
LOWELL, Mass., Sept. 17, 2026 /CourierPR/ -- MACOM Technology Solutions Inc has unveiled a new chipset solution designed to accelerate the development of next-generation optical interconnects for AI infrastructure, cloud data centers, and high-speed networking applications. The 3.2T solution, capable of delivering up to 3.2 terabits per second (Tbps) through eight channels operating at 448 gigabits per second (Gbps) PAM-4, is a significant advancement in the field of optical connectivity.
The chipset combines MACOM's high-performance transimpedance amplifiers (TIAs) and photodiodes in a receiver platform with its previously introduced 448 Gbps PAM-4 drivers on the transmit side. This comprehensive solution is engineered to support new optical architectures, offering key transmit and receive building blocks from a single supplier. By doing so, MACOM aims to simplify development, accelerate time-to-market, and optimize overall link performance for its customers.
According to Stephen G. These devices incorporate RSSI functionality for photo alignment and power monitoring, as well as digital control of bandwidth, output amplitude, peaking, gain, and loss-of-signal thresholds.
The TIAs are paired with MACOM's MARP-BP224 backside-illuminated PIN photodiode, which is optimized for 448 Gbps PAM-4 receiver applications. The photodiode features greater than 100 GHz bandwidth and ultra-low parasitics, maximizing performance and signal integrity in high-speed optical links. Leveraging a proprietary design for high coupling efficiency, the photodiode is available in multiple layouts to support a variety of optical interface implementations.
This comprehensive solution complements MACOM’s previously announced MAOM-025408 and MAOM-022404 driver solutions, which support 448 Gbps PAM-4 optical transmit architectures. By combining drivers, photodiodes, and TIAs within a single portfolio, MACOM is providing customers with a comprehensive set of technologies for next-generation optical module development.