Kulicke & Soffa Wins 2026 SEMI Award for Innovative Bonding Technology

FORT WASHINGTON, Pa., Oct. 13, 2026 /CourierPR/ -- Kulicke & Soffa, a global leader in semiconductor assembly technology, has been honored with the 2026 SEMI Award for North America. The award recognizes the company's groundbreaking Fluxless Thermocompression Bonding (FTC) technology, which addresses critical interconnect scaling challenges and supports the next generation of advanced semiconductor applications.

The award, presented during the CEO Summit Keynotes at SEMICON West, highlights the growing industry adoption and significance of Kulicke & Soffa's advanced packaging portfolio. The company's pioneering FTC technology combines advanced plasma pre-cleaning and in-situ formic acid oxide reduction to deliver high-yield, ultra-fine-pitch interconnect capabilities. This innovative approach simplifies manufacturing processes and reduces production costs, making it a foundational element of the company's advanced packaging roadmap.

Traditional Thermo-Compression bonding often requires a post-bond flux cleaning process, which becomes increasingly difficult at finer interconnect pitches. Hybrid bonding solutions, while highly capable, introduce significant manufacturing complexity and cost. Kulicke & Soffa's proprietary FTC technology addresses these challenges by delivering hybrid-bonding-class performance with more accessible manufacturing. This innovation is enabling customers to pursue interconnect pitches below 10 microns, supporting applications across wafer-level, substrate-level, and panel-level manufacturing environments.

Founded on innovation in 1951, Kulicke & Soffa is uniquely positioned to overcome increasingly dynamic process challenges. The company's advanced packaging portfolio spans thermocompression bonding, hybrid bonding enablement technologies, wedge bonding, and vertical interconnect solutions that support some of the industry's most complex heterogeneous applications.

The award further reinforces Kulicke & Soffa's position as a leading provider of semiconductor interconnect solutions. The company's advanced packaging roadmap is crucial for delivering system-level performance across the semiconductor space. As semiconductor complexity continues to increase, interconnect and packaging innovations are now a requirement for delivering system-level performance.

SEMI, the global industry association connecting over 4,000 companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain, presented the award. SEMI's programs, including advocacy, workforce development, sustainability, supply chain management, and market intelligence, help advance member collaboration on solutions to top industry challenges.

Kulicke & Soffa's innovative FTC technology is a testament to the company's commitment to driving advancements in semiconductor manufacturing. The award underscores the company's leadership in enabling advanced heterogeneous integration and AI-driven semiconductor innovation.