Five Chinese PCB Manufacturers Advancing Electronic Connectivity

CALIFORNIA, CA, UNITED STATES, October 26, 2026 /CourierPR/ -- The global printed circuit board (PCB) market was valued at approximately US$85.8 billion in 2025, with projections from Prismark estimating growth to around US$95.8 billion in 2026. China is expected to account for approximately 60% of global PCB production by 2026, highlighting the continuing importance of Chinese manufacturers in the global electronics supply chain.

Against this backdrop, five reputable multilayer PCB manufacturers in China are advancing electronic connectivity. These companies are SHENZHEN JERICO MULTILAYER PCB CO., LTD, Bomin Electronics Co., Ltd., WUS Printed Circuit (Kunshan) Co., Ltd., Hubei Wuzhou Circuit Technology Co., Ltd., and Kinwong Electronic Co., Ltd. This review considers their publicly described product portfolios, manufacturing focus, and relevance to different electronic applications.

SHENZHEN JERICO MULTILAYER PCB CO., LTD, based in Shenzhen, Guangdong, China, has been operating since 2009. The company reports more than 15 years of PCB manufacturing experience. Its manufacturing facility covers 20,000 square meters and employs approximately 270 people, including an R&D team of 30 engineers. Jerico's stated annual PCB production capacity is 960,000 square meters, with monthly production capacity ranging from 50,000 to 70,000 square meters.

The company's product portfolio includes rigid PCB products from 1 to 18 layers, Heavy Copper PCB, HDI PCB with buried and blind vias, High-Frequency PCB, Metal Core PCB, and other special-material boards. Surface finishes include ENIG, ENEPIG, selective gold plating, OSP, immersion tin, immersion silver, and HASL. Specific material systems, including Rogers PCB, ceramic substrates, Aluminum PCB, and other specialized constructions, should be confirmed against the requirements of each project rather than assumed to be available across the full portfolio.

SHENZHEN JERICO MULTILAYER PCB CO., LTD identifies the European Union and the United States as major export markets, with exports accounting for a stated 40% of total sales. Its published qualifications include ISO 9001, ISO 14001, IATF 16949:2016, UL Recognized status under File No. E519316, CQC, and National High-Tech Enterprise status. The company also reports RoHS, REACH, and SGS compliance test documentation. Buyers should request current certificates and reports to verify their issuing bodies, applicable facilities, product scope, and validity before relying on them for regulated applications.

Documented product specifications illustrate Jerico's stated manufacturing range. PCB-10 is a 4-layer FR-4 board with a lead-free HASL finish, 1 oz copper, a minimum line width and spacing of 3 mil, a minimum hole size of 0.2 mm, and standard thickness options of 1.0 mm, 1.2 mm, and 1.6 mm, with customization also stated to be available. PCB-54 and PCB-55 are 6-layer FR-4 boards with ENIG finishes, a thickness of 1.6 mm, minimum line width and spacing of 3 mil, and a minimum hole size of 0.15 mm. PCB-54 specifies up to 2 oz finished copper for current-carrying circuits, while PCB-55 uses 1 oz copper. PCB-56 is a 4-layer FR-4 board with a thickness of 1.0 mm, ENIG finish, and black solder mask, with company-stated applications spanning telecommunications, automotive, and other electronic equipment.

For more complex designs, TU-883 is described as an 18-layer, two-step HDI PCB with a 2+14+2 stack-up on high-Tg FR-4 material (Tg ≥ 170°C). Its published specifications include a finished thickness of 2.40 mm, a minimum BGA pitch of 0.5 mm, differential impedance of 100Ω ±8%, and single-ended impedance of 50Ω ±10%. The M7 is described as a 32-layer, three-step HDI PCB with a 4+24+4 stack-up on high-Tg FR-4 material (Tg ≥ 180°C), a finished thickness of 3.20 mm, and a minimum BGA pitch of 0.4 mm. The company identifies enterprise-grade high-speed routing applications as a target use case. Both products are described as manufactured to IPC-A-6012 Class 3, with 100% flying-probe electrical testing and X-ray inspection of BGA microvias. These process and acceptance details should be confirmed in the applicable production documentation for a specific order.

On the assembly side, the company's published PCBA-999 example combines a 4-layer FR-4 board with SMT, SMD, and DIP component assembly. This provides a reference point for purchasers evaluating whether PCB Fabrication and PCB Assembly can be coordinated through one supplier.

Bomin Electronics Co., Ltd., founded in 1994 and listed on the Shanghai Stock Exchange under stock code 603936, offers an integrated "PCB + Components + Solutions" offering. Its production bases are in Shenzhen, Meizhou, and Jiangsu.