ETEL Unveils METIS HP for High-Precision Semiconductor Applications

SAN FRANCISCO, Oct. 13, 2026 /CourierPR/ -- ETEL, a leading supplier of high-performance motion control components and complete motion platforms, has unveiled the METIS HP, a new full air bearing planar platform designed for the most demanding step-and-scan semiconductor applications, including direct laser writing and high-resolution optical inspection systems. This innovative product further cements ETEL’s position as a leader in high-precision motion control.

The METIS HP is engineered to meet the stringent requirements of step-and-scan semiconductor applications, offering exceptional speed and stability, outstanding dynamic straightness, and projected tool-point measurement capability. The platform is equipped with a multi-degree-of-freedom (mDoF) HEIDENHAIN encoder, ensuring accuracy without thermal drift. This architecture enables precise projected tool-point measurement, making the METIS HP a compelling alternative to traditional interferometer systems. ETEL controllers can emulate a transistor-transistor logic (TTL) position signal for use as a trigger event, eliminating the need for a mirror on the carriage, reducing air lensing effects, and lowering overall costs.

The METIS HP delivers outstanding performance, with ±150 nm accuracy over the full XY stroke after mapping and ±150 nm dynamic straightness at speeds up to 1 m/s. These capabilities minimize turnaround time, thereby increasing machine throughput for step-and-scan applications. High-end inspection applications for advanced packaging require rapid and precise focal-distance adjustments, and the METIS HP is the optimal platform for these demanding inspection tasks, thanks to its high-bandwidth 4-DoF module providing fine control over the Z, tip, tilt, and theta axes.

ETEL is now accepting OEM integrations for the METIS HP. For further information, visit ETEL’s website at www.etel.ch/contact. The company will also showcase the METIS HP at the HEIDENHAIN Booth 1639 during SEMICON West, taking place October 13-15, 2026, in San Francisco. Panel sizes up to 600 mm × 600 mm are supported, addressing the growing need for next-generation maskless lithography with large-area substrates. The platform reaches accelerations up to 20 m/s², ensuring consistent performance even at high scanning velocities.