Aeluma Partners with SCAT to Accelerate Photonics Wafer Production for AI Datacom Market

GOLETA, Calif., Sept. 15, 2026 /CourierPR/ -- Aeluma, Inc., a semiconductor company specializing in high-performance technologies for AI, mobile, and consumer applications, has entered into a strategic agreement with Sumitomo Chemical Advanced Technologies (SCAT) to accelerate the development and production of photonics wafers for the AI datacom market. The collaboration will initially leverage SCAT’s existing metalorganic chemical vapor deposition (MOCVD) capabilities at its Phoenix, Arizona, facility, with plans for future capacity expansion.

Aeluma’s proprietary platform combines best-in-class materials with mass-market microelectronics manufacturing, addressing the growing demand for high-performance photonics components such as photodetectors and lasers. Traditional InP manufacturing is limited by the availability of InP substrates, which are in short supply and subject to geopolitical risks. To mitigate these challenges, Aeluma has developed a heterogeneous integration approach that leverages non-InP substrates, including 150mm gallium arsenide (GaAs) and 200 to 300mm silicon (Si), which are more readily available.

SCAT, a wholly owned subsidiary of Sumitomo Chemical, produces epitaxial wafers for the optical communications, smartphone, wireless, and automotive industries. The partnership with Aeluma aims to strengthen their relationship and facilitate accelerated development, qualification, production, and potential future expansion. Dr.

Dr. Ken Campman, President and Executive Officer of SCAT, added, "The demand for epitaxial wafers for photodetectors and lasers has grown significantly, but the limited supply of InP substrates is a limiting factor. Aeluma’s technology is a promising solution for the datacom market and may impact other markets as well."

The agreement between Aeluma and SCAT is expected to provide a more flexible and scalable solution for the production of photonics wafers, addressing the challenges posed by the shortage of InP substrates and the time and resource-intensive process of establishing new fabrication facilities. This strategic partnership is a significant step for both companies in meeting the increasing demand for high-performance photonics components in the AI datacom market.