ACM Research Introduces Enhanced Single-Wafer Hot SPM System
News related to:ACM Research, Inc · 2 min read
FREMONT, Calif., Oct. 21, 2026 /CourierPR/ -- ACM Research, a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, has introduced an enhanced version of its 170°C Single-Wafer Hot Sulfuric Peroxide Mixture (SPM) system. This new iteration features a sulfuric acid recycle capability, which has been validated by a foundry customer across more than 50 process layers, showcasing its versatility in supporting a broad range of cleaning applications.
The enhanced Single-Wafer Hot SPM system has proven to achieve particle counts of 15 or fewer at 15 nm and above, significantly outperforming mainstream market solutions. Unlike conventional systems that require periodic deionized (DI) water rinsing to remove crystalline deposits caused by acid mist during hot SPM processing, ACM’s proprietary nozzle design effectively prevents such contamination. This design enables stable cleaning performance without the need for periodic DI water chamber cleaning, thereby improving yields in both logic and memory applications while reducing equipment maintenance requirements.
The new sulfuric acid recycle capability in the system achieves a 70% sulfuric acid recycle rate, while maintaining particle control performance as demanded by customer specifications. This innovation is expected to save approximately 400 tons of sulfuric acid per tool annually, delivering significant environmental and cost benefits. The system is designed to address the complex demands of semiconductor manufacturing, where manufacturers must balance stringent cleaning and particle control requirements with the need to manage chemical consumption and operating efficiency.
The Single-Wafer Hot SPM system is widely used in semiconductor manufacturing for various applications, including photoresist stripping, organic polymer residue removal, metallic impurity and particle removal, and post-chemical-mechanical-polishing (CMP) cleaning. ACM's new innovation further enhances the efficiency of the platform by recovering and reusing a significant portion of the sulfuric acid used during processing, thereby reducing chemical consumption without compromising process performance.
The system has been validated by a foundry customer across more than 50 process layers, demonstrating its ability to support a broad range of cleaning applications. This validation underscores the platform's versatility and reliability, making it a valuable tool for manufacturers looking to improve productivity and product yield.
Forward-looking statements in the press release are based on ACM Research's current expectations and beliefs and involve a number of risks and uncertainties. Readers are advised not to place undue reliance on these forward-looking statements, which speak only as of the date of the release. ACM Research undertakes no obligation to publicly update these forward-looking statements to reflect events or circumstances that occur after the date of the release.