ZEISS Introduces NLX and DUNE for Advanced Semiconductor Packaging

SAN FRANCISCO, CA, UNITED STATES, October 12, 2026 /CourierPR/ -- ZEISS has bolstered its advanced packaging portfolio with the introduction of ZEISS NLX and ZEISS DUNE, solutions designed to address critical challenges in semiconductor manufacturing. These technologies are part of ZEISS Semiconductor Manufacturing Technology (SMT), which plays a pivotal role in various stages of chip production, from lithography optics and photomasks to advanced packaging.

The new ZEISS NLX system makes it possible to inspect the internal structures of modern chip packages without damaging them. This capability is particularly useful for identifying potential defects in connections between stacked dies, enabling chip manufacturers to catch issues early in the development and production phases. The system is optimized for 300-millimeter wafers and supports both the development of new processes and high-volume production.

ZEISS DUNE, on the other hand, tackles the issue of wafer bow, a critical challenge in complex production processes. This system measures the topography of a wafer and can correct it individually, ensuring that the wafer is flat and free from deformations. Such precision is crucial for avoiding yield losses in downstream processing and preparing for bonding processes.

ZEISS SMT's broader technology portfolio also includes advanced photomask solutions, such as ZEISS AIMS® EUV 3.0. This system inspects photomasks under conditions similar to those in the wafer scanner, allowing for the early detection and evaluation of critical defects. ZEISS AIMS® EUV 3.0 supports both Low-NA-EUV and High-NA-EUV lithography and triples mask throughput, making it a valuable tool for leading chip manufacturers.

In recognition of its long-standing presence in the United States, ZEISS is marking 100 years of its business in the country in 2026. As a key player in the semiconductor industry, ZEISS SMT serves as a strong technology partner, offering solutions for critical process steps in microchip production, from lithography and photomasks to advanced packaging.

With these advancements, ZEISS continues to play a vital role in the semiconductor manufacturing landscape, ensuring that the next generation of chips can be produced with precision and efficiency.