Winbond Launches CRA Kit for Secure Flash Compliance

TAICHUNG, Taiwan, Nov. 4, 2026 /CourierPR/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of its CRA Conformance and Integration Kit for its TrustME® W77Q Secure Flash family. The package is designed to help manufacturers accelerate readiness for the European Union's Cyber Resilience Act (CRA) by providing hardware security, software, integration guidance, testing resources, reference designs, and security evidence in a unified package. The CRA introduces cybersecurity requirements across the lifecycle of products with digital elements, covering areas including secure design and development, production, vulnerability handling, software maintenance, and technical documentation. Winbond's CRA Conformance and Integration Kit helps customers translate these requirements into implementation and system-level verification activities.

TrustME® W77Q Secure Flash has achieved SESIP Level 2 certification, providing independently assessed security evidence to support customers in evaluating the component's security and their own product-level compliance activities. Component-level certification does not by itself establish CRA conformity of the finished product.

For platforms already using external NOR Flash, W77Q can provide a practical migration path where package, voltage, interface, and system requirements align. While integration may require hardware and software changes, W77Q can strengthen external memory security without adding a separate security component or requiring a complete platform redesign.

The CRA Conformance and Integration Package includes CRA Security Objective Mapping, which maps relevant CRA Annex I security objectives to W77Q security capabilities. It also includes Hardware Integration Guidelines, which provide guidance for integrating W77Q as an external NOR Flash solution while minimizing board-level changes. Additionally, the package includes a Low-Level Security Library and Sample Code, which provides software components and examples for secure storage, authentication, software updates, recovery, and lifecycle management. The CRA Integration Test Suite includes positive and negative test scenarios and reusable test cases for system verification. The CRA Conformance Collateral provides risk-assessment templates, vulnerability-handling and supply-chain documentation, security characteristics, and reusable security evidence. The Conformity Checklist and Reference Designs provide implementation guidance and reusable examples combining W77Q with selected MCU platforms. Open-Source Resources include selected open-source implementations, Linux reference drivers, and remote secure software-update components.

The CRA Integration Kit also builds on Winbond's post-quantum cryptography (PQC) work for Secure Flash. Supported W77Q devices use the Leighton-Matiyasevich Signature (LMS) scheme specified in NIST SP 800-208 to authenticate firmware and software updates. W77Q security capabilities, including protected storage, authenticated software updates, version enforcement, rollback protection, and recovery, support security throughout the product lifecycle. These capabilities can help Original Equipment Manufacturers (OEMs) address security requirements for long-life connected products while providing a path to PQC-protected update authentication where supported by the selected device and system architecture.

The Winbond CRA Conformance and Integration Kit is designed for connected products across industrial automation, Industrial Internet of Things (IIoT), networking, smart buildings and access control, HVAC, energy, electric vehicle (EV) charging, smart appliances, and other applications requiring secure lifecycle management and CRA readiness.

Winbond was established in September 1987 and listed on the Taiwan Stock Exchange in 1995. The company is headquartered at the Central Taiwan Science Park (CTSP) in Taichung, Taiwan, and operates two highly automated and intelligent 12-inch wafer fabs in Taichung and Kaohsiung. Winbond is committed to providing comprehensive integrated circuit solutions to customers worldwide, with major product lines including Code Storage Flash, Customized Memory Solution (CMS), and various logic IC solutions.

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the introduction of its CRA Conformance and Integration Kit for its TrustME® W77Q Secure Flash family. The package is designed to help manufacturers accelerate readiness for the European Union's Cyber Resilience Act (CRA) by providing hardware security, software, integration guidance, testing resources, reference designs, and security evidence in a unified package. The CRA introduces cybersecurity requirements across the lifecycle of products with digital elements, covering areas including secure design and development, production, vulnerability handling, software maintenance, and technical documentation. Winbond's CRA Conformance and Integration Kit helps customers translate these requirements into implementation and system-level verification activities. TrustME® W77Q Secure Flash has achieved SESIP Level 2 certification, providing independently assessed security evidence to support customers in evaluating the component's security and their own product-level compliance activities. Component-level certification does not by itself establish CRA conformity of the finished product.