WIN Semiconductors Expands Partner Network with SawStreet LLC

WIN Semiconductors, a leading global provider of pure-play GaAs and GaN wafer foundry services, has expanded its partner network by welcoming SawStreet LLC to its WIN ALLIANCE Partner Program. This move aims to provide WIN customers with an additional U.S. source for wafer grinding, thinning, dicing, pick-and-place, and die inspection services.

Based in Orlando, Florida, SawStreet specializes in handling wafer thicknesses as low as 50 µm. The company offers a range of services including wafer grinding and thinning, dice-before-grind (DBG), precision dicing, high-speed pick & place, and visual die inspection to MIL-STD-883 Condition A or B, or to customer internal specifications. This expertise complements the services provided by WIN Semiconductors, offering customers a more robust backend processing option.

Jim Young, President and CEO of SawStreet LLC, expressed his excitement about joining the WIN Alliance.

WIN Semiconductors Corp. (TPEx: 3105) has been providing foundry services from its state-of-the-art, ISO 9001/14001-certified 150 mm GaAs facility headquartered in Taoyuan City, Taiwan. The company offers a diverse portfolio of Heterojunction Bipolar Transistor (HBT), Pseudomorphic High Electron Mobility Transistor (pHEMT), Gallium Nitride High Electron Mobility Transistor (GaN HEMT), PIN diode, and optical device technology solutions that support leading-edge products for applications from 50 MHz to 170 GHz and through light-wave.

For more than 25 years, WIN has provided foundry services to a vast array of markets, including smartphone, mobile infrastructure, 3D sensing, optical communications, CATV, aerospace, defense, satellite, and automotive applications. The addition of SawStreet LLC to the WIN ALLIANCE Partner Program underscores the company's commitment to offering comprehensive and flexible backend processing solutions to its customers.

SawStreet is a privately owned, quick-turn semiconductor backend service provider based in Orlando, Florida. The company offers grinding, dicing, pick-and-place, and inspection services engineered for the demanding requirements of defense, aerospace, and RF applications, and handles a wide range of substrates including GaAs, InP, SiGe, GaN/SiC, fused silica, and sapphire.