SUSS Enters Wafer-Cleaning Market with GreenTec Solutions

SUSS MicroTec SE, a leading supplier of equipment and process solutions for the semiconductor industry, has expanded its technology portfolio by entering the wafer-level cleaning market with the launch of the GreenTec Solutions product line and its first system, the GT200. This move marks an important milestone in the execution of the company's Ambition 2030 strategy.

The GreenTec Solutions product line aims to address the growing wafer-cleaning market, which today represents an addressable market of approximately €5.4 billion and is driven by advanced packaging, heterogeneous integration, and increasing semiconductor demand from AI and high-performance computing applications. SUSS's entry into this market is expected to leverage its existing expertise in photomask processing and extend it to wafer-level production.

The GT200, a hybrid cleaning system, combines the proven SUSS process technologies TurbulenStrip™ and CrustBuster™. TurbulenStrip™ incorporates lower-impact batch soaking and single-wafer handling for efficient resist and residue removal, while CrustBuster™ utilizes patented in-situ UV technology to break down and remove organic materials directly at the wafer surface. Together, these technologies enable highly efficient residue removal and process stability, helping customers reduce chemical consumption, support their sustainability targets, and lower overall cost-of-ownership.

The GT200 is specifically designed for research and development, process qualification, and production in 200 mm manufacturing environments for MEMS, RF, Power Device, and CMOS applications. SUSS supports customers through joint evaluation programs, process co-development, and recipe optimization services to accelerate adoption, improve process stability, and de-risk technology transfers ahead of volume production ramps.

SUSS MicroTec SE, headquartered in Garching, Germany, has approximately 1,500 employees worldwide and recently generated sales of approximately €500 million. The company operates production sites in Germany and Taiwan and development centers in Europe, Asia, and the US, supported by a strong network of sales and service offices with close proximity to its customers. SUSS MicroTec SE is listed on the Frankfurt Stock Exchange (Prime Standard, FWB: SMHN; ISIN DE000A1K0235) and is part of the TecDAX and MDAX indices.

Following the strategic approach of expanding into high-volume manufacturing, SUSS plans to introduce a dedicated 300 mm HVM platform in 2027. A 200 mm HVM platform will follow in 2028, providing customers with a clear migration path from evaluation to full-scale production. This approach is designed to consolidate multiple cleaning and stripping steps, reduce wafer transfers, and simplify toolset complexity, thereby improving operational efficiency.

The launch of the GreenTec Solutions product line represents SUSS's vision for the next generation of semiconductor manufacturing, where sustainability and process excellence go hand in hand. By combining greener process media with advanced technologies adapted from proven solutions developed by SUSS's Photomask Solutions business unit, the GT200 supports shorter process learning cycles, reduced EHS exposure, and lower chemical consumption and hazardous waste generation without compromising process performance.