RND Automation to Showcase Packaging and Automation Solutions at PACK EXPO 2026

CHICAGO, Sept. 25, 2026 /CourierPR/ -- RND Automation, a company specializing in packaging and automation solutions, will showcase its latest equipment and technologies at the PACK EXPO International 2026, taking place from October 18 to 21 at McCormick Place in Chicago. Visitors to booth N-5115 will have the opportunity to witness live demonstrations and explore a range of innovative packaging and automation systems.

At the heart of the exhibit will be the KANGA Pouching machine, which will run continuously throughout the event. This machine will showcase the vertical pouching process, allowing attendees to see firsthand how products can be packaged in a multitool. The demonstration aims to illustrate the flexibility of RND's packaging platforms, which can be adapted to meet various product and packaging requirements.

RND Automation will also highlight its comprehensive packaging equipment portfolio, including MiniPack, MicroPack, TrayPack, and QuickPouch systems. These solutions cater to a wide range of applications, from bagging and pouching to horizontal flexible packaging and tray packaging. Additionally, the company will demonstrate its SureVac leak-testing system, which is designed to ensure package integrity and quality.

A key feature of the exhibit will be RND's High-Risk Test Bench, a configurable platform used to evaluate challenging automation tasks before they are incorporated into full-scale production systems. The Test Bench will feature technologies from automation suppliers such as Doosan Robotics, OnRobot, B&R Industrial Automation, FANUC, Pilz, Banner Engineering, and Festo. This setup will allow RND engineers to test various elements, including robotics, gripping, motion, machine safety, sensing, controls, product handling, and package testing, under realistic conditions.

The company will also showcase an FANUC M-710 industrial robot, illustrating how RND integrates robotics into its automation systems. This display will demonstrate RND's ability to address more than just the packaging machine, extending into robotics, product feeding and handling, inspection, testing, controls, machine safety, and production-line integration.

Attendees can visit RND Automation at Booth N-5115 in the North Hall at McCormick Place in Chicago during the PACK EXPO International 2026. The event offers a chance to explore the latest in packaging and automation technologies, as well as discuss current projects with the RND team. Visitors can also enter RND's PACK EXPO giveaway for a chance to win a Bambu Lab 3D printer.