Manz Asia and SUSS collaborate to develop next-generation inkjet printing technology

TaoYuan, September 3, 2026, Manz Asia, a leading manufacturer of advanced packaging equipment, has announced a strategic collaboration with SUSS, a global provider of semiconductor process solutions, to jointly develop next-generation inkjet printing technology for advanced packaging and semiconductor manufacturing. This partnership aims to accelerate the transition of inkjet technology from research and development to high-volume manufacturing.

As semiconductor manufacturing progresses toward more complex structures and larger formats, manufacturers are increasingly looking for technologies that offer greater process flexibility, material efficiency, and scalability. Inkjet printing has emerged as a key enabling technology, providing precise and selective material deposition, reducing material consumption, and simplifying process flows. According to experts, this technology can open new opportunities in advanced packaging and other high-value semiconductor manufacturing applications.

Under the collaboration, Manz Asia and SUSS will focus on exploring new inkjet applications, validating materials and processes, and developing scalable manufacturing approaches. Manz Asia brings its proven inkjet capabilities, manufacturing engineering expertise, and strong position in the panel-level packaging ecosystem. Its end-to-end inkjet development platform and Lab-to-Fab approach, which cover material and substrate preparation, printing, curing, and process characterization, will be integral to the partnership. SUSS, on the other hand, contributes deep semiconductor process expertise and a global customer reach.

"By combining SUSS's semiconductor process experience with Manz Asia's inkjet expertise, we can accelerate technology development and reduce time-to-market for future solutions," stated Burkhardt Frick, CEO of SUSS. "This collaboration strengthens our access to the emerging panel-level packaging ecosystem, which we believe will play an increasingly important role in next-generation semiconductor manufacturing."

Robert Lin, CEO of Manz Asia, echoed this sentiment, adding, "Through our collaboration with SUSS, we are combining our inkjet printing and manufacturing expertise with SUSS's semiconductor process capabilities and global customer reach. Together, we see strong potential to accelerate the transition of inkjet technology from advanced process development toward high-volume semiconductor manufacturing."

This strategic partnership is expected to support both companies' Ambition 2030 strategies by strengthening their technology portfolios, expanding capabilities in advanced packaging, and increasing exposure to attractive semiconductor growth markets. Manz Asia, headquartered in Taiwan, is a key player in the semiconductor equipment and solutions market, focusing on Electrochemical Deposition (ECD), wet chemistry, digital printing, automation, and software integration. SUSS, headquartered in Garching, Germany, operates globally and has recently reported sales of approximately €500 million, with a network of production sites and development centers across Europe, Asia, and the United States.

Together, Manz Asia and SUSS aim to drive innovation and deliver scalable, next-generation solutions for advanced packaging and future semiconductor applications, significantly contributing to the semiconductor industry's evolution.