Macnica Launches SLVS-EC Bridge Chip for Sony IMX742 Sensor

SOLANA BEACH, Calif., Oct. 27, 2026 /CourierPR/ -- Macnica, a global technology solutions company, has announced the launch of a new bridge chip that integrates Sony's IMX742 sensor into single-use endoscopes, aiming to revolutionize the medical device industry. This development is part of a broader effort to enhance the diagnostic capabilities of single-use endoscopes, which are becoming increasingly popular due to their ability to reduce the risk of cross-contamination and infections.

The new Macnica SLVS-EC IP bridge chip, combined with Sony's IMX742 sensor, enables medical device manufacturers to transmit high-resolution video over 5-meter cables. This innovation simplifies and accelerates the design of next-generation disposable endoscopes, making it easier for manufacturers to meet the growing demand for safer, higher-performance diagnostic and surgical procedures.

Developed in collaboration with Sony, the solution addresses the need for reliable video transmission over long, thin cables. The IMX742 sensor, which measures 1.0 mm x 1.0 mm, uses Sony's SLVS-EC high-speed digital interface, ensuring that video can be transmitted reliably over extended distances. Macnica's SLVS-EC receiver IP, already used in FPGA-based designs for Sony SLVS-EC sensors, now supports the IMX742 on Altera Agilex 5 and AMD Kintex UltraScale+ FPGAs.

Macnica's new bridge chip design, built on Altera Agilex 5, receives the sensor's video at the console and converts it to the industry-standard MIPI CSI-2 interface. This allows manufacturers to connect the sensor to widely used image processors without designing a custom receiver. The evaluation platform, which pairs the IMX742 with Macnica's Power and Splitter card, FMC card, and optional EQ card, plus a Terasic Atum A5 FPGA board, provides a ready-to-use feasibility environment for engineering teams to evaluate image quality, cable length, and system integration before committing to a custom design.

The collaboration between Macnica and Sony reflects Macnica's "Capture, Process, Communicate" approach, which brings together technologies across the imaging signal chain from image capture through processing and connectivity. This solution enables medical device manufacturers to focus more of their engineering resources on product differentiation, clinical performance, and patient needs.

The disposable endoscope market is projected to reach $4.9 billion by 2030, growing at a 7.6% compound annual rate. This growth is driven by heightened infection control awareness, advances in imaging technology, and the need for more efficient medical procedures. As image quality in disposable scopes improves and cables become longer and thinner, single-use endoscopes can move into true diagnostic use and reach deeper anatomy, including duodenoscopy, colonoscopy, and transbronchial procedures in the deep lung.

Macnica's bridge chip and evaluation platform are expected to be available for evaluation beginning in November 2026, aligned with the IMX742 engineering sample availability. For more information, visit Macnica's website at www.macnica.com/global/en/services/semiconductors/IMX742.html.