High Density Packaging User Group and Global Electronics Association Release New Copper Profile Test Method
News related to:HDP User Group International · 2 min read
AUSTIN, Texas, Oct. 15, 2026 /CourierPR/ -- High Density Packaging User Group (HDP) and the Global Electronics Association have jointly announced the release of a new test method, IPC-TM-650-2.2.23, based on the findings of HDP's Non-Contact Copper Foil Profile project. This development is significant for high-speed, high-performance applications where lower copper roughness is essential.
The new test method aims to address the critical need for precise measurement and control of copper foil profiles, which are crucial in modern electronics manufacturing. According to Larry Marcanti, Executive Director of HDP, this is a significant step forward.
The Non-Contact Copper Foil Profile project, led by Tsuyoshi Hiroaki of Mitsui-Kinzoku, provided the empirical data necessary for the creation of the new test method.
Matt Kelly, CTO and Vice President of Technology Solutions at the Global Electronics Association, expressed enthusiasm for the collaboration.
The Global Electronics Association, formerly known as IPC, is the leading voice of the $6 trillion global electronics industry. Since its inception in 1957, the organization has supported the growth and success of more than 3,000 member companies across the electronics supply chain, from design and printed circuit board manufacturing to advanced packaging, assembly, and testing.
HDP User Group, based in Round Rock, Texas, is a global research and development organization dedicated to reducing the costs and risks for the electronics manufacturing industry when using advanced electronic packaging and assembly. The group organizes and conducts R&D programs to address the industry's technical issues, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance.
This new test method, IPC-TM-650-2.2.23, is expected to enhance the accuracy and reliability of copper foil profile measurements, thereby improving signal integrity in high-performance electronics. The collaboration between HDP and the Global Electronics Association underscores their commitment to advancing the state-of-the-art in electronics manufacturing.
The release of this test method is a testament to the ongoing efforts of industry leaders to innovate and improve the quality of electronic components. As technology continues to evolve, such advancements in measurement and testing methodologies are crucial for maintaining the high standards required in high-speed and high-performance applications.