Fabric.AI Files Patent Applications for Micro-LED Optical Interconnect Technology

NEW YORK, NY, Sept. 23, 2026 /CourierPR/ -- Fabric.AI, an AI infrastructure company developing a suite of fabless semiconductor technologies for next-generation AI factories, has filed two patent applications with the United States Patent and Trademark Office (USPTO). The filings cover its micro-LED optical interconnect architecture, which is designed to address bandwidth and energy-efficiency constraints in next-generation AI data centers.

The first application details Fabric.AI's approach to fiber-coupled optical interconnect. This architecture uses a novel optical system to image an entire micro-LED array onto the cores of a multicore optical fiber. The architecture is designed to maintain the number of precision alignment steps constant as the channel count rises, rather than requiring alignment channel by channel. The second application takes this same optical approach to its limit, transmitting parallel data across a short air gap, eliminating the need for any physical connectors between the optical endpoints.

Both applications derive from the same design choice: imaging an entire micro-LED array through a novel optical system, rather than aligning light channel by channel. This approach is expected to keep assembly complexity flat as the number of optical channels scales from hundreds to thousands, and it allows the removal of connectors where the gap is short enough.

The technology uses compact optics to image the micro-LED array directly onto a matching detector array, holding the channels separate. Because the coupling is imaged rather than bonded, the fiber becomes optional: for short, fixed gaps inside a package or between adjacent boards, removing the connector removes both a failure point and an assembly step.

These applications also underscore Fabric.AI's continued collaboration with Kopin Corporation on Neural I/o™, its optical interconnect architecture designed to address the increasing data-movement, bandwidth, and energy-efficiency demands of next-generation AI infrastructure. The Company expects to demonstrate working Neural I/o hardware in January 2027.

The Neural I/o™ platform is a key part of Fabric.AI's suite of fabless semiconductor technologies for next-generation AI factories. It is designed to improve the efficiency and speed of data movement within these factories, which are critical for the rapid processing and analysis of large volumes of data generated by AI systems.

Kopin Corporation, a leading developer and provider of innovative display and application-specific optical solutions, is collaborating with Fabric.AI on the development of this technology. Kopin's portfolio includes microdisplays, display modules, eyepieces and projection assemblies, and vehicle- and head-mounted display systems built on Kopin's liquid crystal, MicroLED, and OLED display technologies, along with a range of optics and low-power custom silicon. Building on its patented bi-directional NeuralDisplay™ architecture, Kopin is also developing Neural I/o™ optical interconnects that use programmable MicroLED pixels as ultra-high-speed, low-power optical transceivers for AI data centers.

The collaboration between Fabric.AI and Kopin Corporation is expected to result in significant advancements in the field of AI infrastructure, particularly in the area of optical interconnects. By eliminating the need for physical connectors and reducing assembly complexity, the Neural I/o™ platform promises to improve the efficiency and speed of data movement within AI data centers, ultimately leading to more powerful and efficient AI systems.

These applications also highlight the importance of collaboration between different companies in the technology sector. By combining their respective strengths and expertise, Fabric.AI and Kopin Corporation are able to develop innovative solutions that address the challenges faced by the AI infrastructure industry. This collaboration underscores the importance of continued innovation and collaboration in the tech sector, as well as the potential for significant advancements in the field of AI infrastructure.

In summary, Fabric.AI's filing of two patent applications with the USPTO underscores its commitment to developing advanced optical interconnect technologies for AI data centers. The applications detail the company's fiber-coupled and connector-free micro-LED optical interconnect architecture, which is designed to address bandwidth and energy-efficiency constraints in next-generation AI data centers. The applications also underscore the company's continued collaboration with Kopin Corporation on the development of the Neural I/o™ platform, which is expected to result in significant advancements in the field of AI infrastructure.