Altair Integrates Iridium NTN Direct into IoT Chipsets

News related to:Altair Semiconductor · 3 min read

MCLEAN, Va., Oct. 14, 2026 /CourierPR/ -- Altair Semiconductor, a world leader in cellular IoT chips, has integrated Iridium’s NTN Direct℠ capability into its ALT1350 and next-generation ALT1550 IoT chipset platforms. This integration allows device manufacturers, module makers, and mobile network operators (MNOs) to extend IoT connectivity beyond the reach of terrestrial networks through the Iridium satellite network, without the need for a separate satellite modem.

The partnership combines Altair's highly integrated, low-power IoT chipset technology, among the most highly integrated low-power connectivity solutions available, with Iridium's 3GPP standards-based non-terrestrial network (NTN) service. With the ultra-low-power ALT1350, these connectivity requirements can include asset tracking, logistics, smart metering and utilities, agriculture, vehicle telematics, industrial monitoring, and remote infrastructure. The ALT1550 extends these capabilities to a new generation of AI-powered 5G eRedCap devices, such as smart glasses, AI assistants, and other wearables.

Iridium NTN Direct leverages Iridium's fully operational, LEO satellite constellation and globally coordinated L-band spectrum to extend standards-based connectivity beyond terrestrial networks. The service is designed to support NB-IoT and direct-to-device (D2D) applications using compatible 3GPP standards-based chipsets, providing MNOs, chipset manufacturers, and device makers with a path to extend connectivity through the Iridium satellite network.

Altair joins a growing ecosystem of partners bringing the Iridium NTN Direct service to market. A combination of chipmakers, module manufacturers, OEMs, device makers, and IoT developers is leading the next generation of NTN-cellular integration with Iridium NTN Direct. This integration marks a significant step in expanding the reach of IoT devices, particularly in areas where terrestrial networks are not available. The partnership between Altair and Iridium is expected to drive innovation and enhance the reliability of IoT solutions across various industries.

The integration of Iridium NTN Direct into Altair’s chipsets is part of a broader strategy to provide device manufacturers with a robust and flexible connectivity solution. This move is particularly significant for companies operating in remote or challenging environments where terrestrial networks are unreliable or non-existent. The partnership is expected to open new markets and applications for IoT devices, driving growth in sectors such as agriculture, transportation, and industrial monitoring.

The release also notes that Iridium NTN Direct is designed to support NB-IoT and direct-to-device (D2D) applications using compatible 3GPP standards-based chipsets. This capability is crucial for ensuring that devices can communicate reliably and efficiently, even in areas where traditional cellular networks are not available. The integration of Iridium’s satellite connectivity into Altair’s chipsets is expected to provide a seamless and reliable connection, enhancing the overall performance and functionality of IoT devices.

In addition to the technical details, the release highlights the broader ecosystem of partners involved in bringing Iridium NTN Direct to market. This includes a wide range of companies, from chipmakers and module manufacturers to original equipment manufacturers (OEMs) and device makers. The collaboration between these entities is expected to drive innovation and accelerate the adoption of satellite-based connectivity solutions in the IoT space.

For more information about Iridium NTN Direct, interested parties can visit the company’s website at www.iridium.com/ntn-direct. The release also references the company’s Form 10-K for the year ended December 31, 2025, filed with the Securities and Exchange Commission (SEC) on February 12, 2026, and the company’s Form 10-Q for the quarter ended June 30, 2026, filed with the SEC on July 22, 2026, for additional details.

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